Foldable Flex and Thinned Silicon Multichip Packaging Technology

Foldable Flex and Thinned Silicon Multichip Packaging Technology by John W. Balde

Foldable Flex and Thinned Silicon Multichip Packaging Technology

Binding:
Kindle Edition
Number of Pages:
360
ISBN:
Product Group:
book
Publisher:
Springer
Publication Date:
Jan. 31, 2003
BooksForGeeks.com ID:
17966

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